ABOUT US

Brad Kennedy – CEO

Prior to SisTech, Brad was the VP of Operations for Vadatech Inc., a designer and manufacturer of leading edge technology products, (AMC, aTCA and uTCA) for the embedded marketplace, both Military and commercial. Brad was responsible for the ground up construction of Vadatech’s state-of-the-art manufacturing facility located in Las Vegas, NV. He ran all aspects of operations and manufacturing.

Prior to Vadatech, Brad was the General Manager / Plant Manager for GE Fanuc Embedded Systems Group (Camarillo, CA), where he was responsible for the aspects of division operations. He and his team effectively met all sales and profits goals set before him while maintaining on-time delivery and exceptional quality. The GE Camarillo facility was a result of GE’s acquisition of RAMiX, Inc., an OEM of PMC, VME, cPCI and custom products for the embedded marketplace. Brad was the General Manager of RAMiX, Inc., where he was responsible for all aspects of Manufacturing, Operations and Quality. He also played a key role in ensuring a smooth transition once the company was sold to GE Fanuc in March of 2003.


Calvin Rabe – Operations Manager

Prior to SisTech, Calvin was a Field Service Engineer for Europlacer Americas working on the SMT printers and pick and place equipment that SisTech currently uses.  Calvin also was Operations Manager for Silicon Forest Electronics with over 20 years of experience in manufacturing, inventory, quality, and production.  He has a diverse knowledge base of manufacturing operations and practices derived from experience.  Calvin also reviews customer supplied packages, imports customer BOMs into our MRP system, creates programs for automated assembly, and supports all manufacturing requirements at SisTech.

Ryan Kochert – Head of Operations

Prior to SisTech, Ryan served in the United States Marine Corps and with Joint Special Operations as an intelligence officer. He commanded at levels ranging from small, specialized teams in combat, to more than 170 special operations collectors across 7 different countries. He identified unique solutions and built networked teams from across the US government to tackle previously unsolved, convoluted, multi-dimensional problems; from executing irregular warfare strategies against national threat networks to designing risk analysis models for sensitive special operations activities around the globe.

Ryan holds a MS in Electrical Engineering and Computer Science from MIT, an MBA from MIT Sloan, and a BS in Systems Engineering from the United States Naval Academy. For his master's thesis, he designed and implemented custom deep learning models for various manufacturing applications.


THE FACILITY

SisTech’s newly constructed facility offers the following capabilities and equipment.

Manufacturing Capabilites

  • OMAP & PoP assembly
  • 01005 Placement Capability
  • BGA, microBGA and CSP Placement
  • Quick Turn Prototype Build to Large Volume Production
  • RoHS Compliant (pB Free) and Leaded Capabilities
  • X-Ray inspection services

Partial Equipment List

  • (3) Europlacer IINEO II Dual Gantry SMT Machines (2014, 2019, 2020)
  • (1) Europlacer XPii Dual Gantry SMT Machine (2020)
  • (1) Europlacer Atom 2 Dual Gantry SMT Machine (2022)
  • (3) Speedprint Sp700avi Screen printers with Paste Inspection (2011, 2014, 2018)
  • (1) Vitronics XPM3i Reflow oven (10 zone) (2011)
  • (2) ERSA HotFlow 3/20 Reflow Ovens (2009, 2014)
  • (2) ERSA EcoSelect II Selective Soldering Machines (2010, 2015)
  • (1) MirTec MV-3L (2022)
  • (2) Mirtec MV9-3D AOI (2013, 2015)
  • (1) Aqueous Tech Trident Duo CL (2017)
  • (1) Aqueous Tech Trident Duo CL with Rinse Water Recycler (2020)
  • (1) ERSA VersaFlow Selective Solder Machine (2017)
  • Charter microBulk Liquid Nitrogen system
  • (1) Nordson Dage Ruby X-Ray with X-Plane (2015)
  • (1) Air-Vas ONYX 29 Precision Rework System (2015)
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