Expert Printed Circuit Board Assembly Services

Precision, Reliability, and Speed for Your Critical Applications in the Pacific Northwest and Beyond

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(PWB-ASSY)

Flexible PCB Assembly Services

Turnkey PCB Assembly

SisTech offers comprehensive, full turnkey PCB assembly services, meticulously managing the entire process from initial component procurement to final testing and drop shipping. We handle every detail, allowing you to concentrate on your core business strengths. This includes sourcing all necessary components from trusted, vetted suppliers, expertly assembling the boards, performing rigorous testing procedures, and even arranging direct shipment to your end customers, whether they’re in the Pacific Northwest or across the country. We are equally adept at supporting both high-volume production runs and low-volume, quick-turn prototype builds. For businesses, this means faster turnaround times, quicker product iterations, and more expeditious time to market.

Pain Points Addressed by Turnkey Assembly

Supply Chain Headaches

Managing a complex supply chain with numerous vendors can be time-consuming and prone to errors. We handle all procurement, using our multitude of vetted suppliers, eliminating this burden.

Inventory Management Challenges

Storing and managing components requires space and resources. We manage all inventory, reducing your overhead.

Production Bottlenecks

Ramping up production quickly can be difficult without the right infrastructure and expertise. We provide the scalability and flexibility you need. For many of our customers, they want the ability to pull in products as needed. We offer the option to provide a high safety stock service level by manufacturing their products well in advance. They then have the freedom to pull in their finished assemblies as they need them to meet shifting customer demands.

Quality Control Concerns

Ensuring consistent quality across the entire assembly process is critical. We employ rigorous quality control measures at every stage and we are constantly looking to improve our QMS with the latest technology and industry research.

Kitted PCB Assembly

We understand that sometimes you may only need assistance with component procurement or have material and need the product assembled. While we prefer turnkey to help keep the costs low and reduce lead-times, SisTech provides a meticulous and cost-effective kitting service, designed to streamline your operations. This allows you to maintain control over your supply chain and component inventory while leveraging our assembly process expertise.

Advanced PCB Assembly Capabilities

Specialized Assembly Expertise

SisTech is fully equipped to handle a wide range of PCB assembly requirements, from the simplest to the most complex designs, consistently delivering exceptional results. Our capabilities include:

OMAP & PoP Assembly:
Our technicians possess specialized expertise in assembling complex Open Median Application Platform (OMAP) and Package-on-Package (PoP) components, critical for high-performance applications.
01005 Placement Capability:
We offer precision placement of even some of the smallest 01005 component packages, enabling high density performance for your HDI and UHDI boards.
BGA, microBGA, LGA, and CSP Placement:
Our team provides reliable and precise assembly of Ball Grid Array (BGA), microBGA, Land Grid Array (LGA), and Chip Scale Package (CSP) components, essential for modern, compact electronics.

Production Volume Flexibility

Quick-Turn Prototype Builds:
We offer rapid prototyping services to accelerate your product development cycle, getting your innovations to market faster. This is crucial for businesses in fast-paced industries.
High-Volume Production:
Our facility is equipped to rapidly scale assembly services for large production runs, providing the capacity you need to meet market demand. We support businesses across the US and products in all stages of the lifecycle

Quality Assurance and Compliance Excellence

Certifications:
ISO 9001:2015, ITAR Registered, IPC-A-610 certified, IPC-7711/7721 certified, and J-STD-001 certified. We are committed to rigorous quality management systems and industry best practices.
Counterfeit Parts Program:
We have a robust program in place to prevent the use of counterfeit components, protecting the integrity and reliability of your products.
Traceability and Accountability:
We offer meticulous lot tracking and traceability for all assembled boards, providing complete transparency and accountability throughout the manufacturing process.
RoHS Compliant and Leaded Capabilities:
We offer both RoHS (lead-free) compliant and leaded assembly processes to meet your specific product requirements and regulatory compliance needs.

State-of-the-Art Capabilities

Our newly constructed facility in Bend, Oregon, is equipped with the latest technology to ensure precision, efficiency, and quality in every project.
We are committed to continuous improvement and invest heavily in advanced equipment and training.

Key Equipment Highlights

Europlacer SMT Pick-and-Place Machines (including new IINEO and Atom models)

These state-of-the-art machines provide high-speed, high-precision placement of components, including 01005, BGA, microBGA, LGA, CSP, and PoP. Each machine is capable of speeds up to 35,000 chips per hour placement rates.

ERSA Reflow Ovens (12-zone HotFlow models)

Our ERSA reflow ovens ensure consistent and reliable soldering of components to the PCB.

ERSA and Speedprint Screenprinters

These screenprinters provide accurate and repeatable solder paste application and inspection, a critical step in the SMT assembly process.

Mirtec 3D AOI Machines

Our Mirtec 3D AOI machines provide automated optical inspection capabilities, detecting even the smallest defects and ensuring the highest quality standards.

Nordson DAGE Automatic X-ray with X-Plane CT Scan

Our X-ray inspection system allows us to visualize hidden solder joints and internal components, ensuring the integrity of complex assemblies.

ERSA Selective Solder Machines

For through-hole components and other specialized soldering needs, our ERSA selective solder machines provide precise and efficient soldering.

Onyx Precision Rework Station

For reworking and replacing leadless components and connectors.

Manufacturing Capabilities

Extensive Form Factor Expertise

Broad Form Factor Support

The SisTech team possesses many years of hands-on experience working with a wide variety of PCB form factors, ensuring we can meet the diverse needs of our customers. This includes, but is not limited to:

PMC
XMC
cPCI
VME
AMC
uTCA
aTCA
VPX

Adaptability and Custom Solutions

In addition to the form factors listed above, we are capable of assembling any form factors presented to us by our Customers. Our engineering team thrives on challenges and is committed to finding solutions for even the most unique requirements. We understand that innovation often requires custom solutions, and we are dedicated to supporting your specific needs.

Our Detailed PCB Assembly Process

Initial Consultation

We begin with a detailed consultation to understand your project requirements, specifications, and timelines to ensure we can meet or exceed your expectations. We are happy to sign NDAs or fill out new vendor forms as necessary.

Design Review & DFM Feedback

Our experienced engineers meticulously review your design files and provide comprehensive Design for Manufacturing (DFM) recommendations to improve manufacturability, reduce costs, and enhance overall product quality. We offer insightful feedback that other manufacturers often overlook, significantly increasing yields, especially with complex assemblies commonly found in industries we serve, like aerospace and defense.

Initial File Review - Assessing Bill of Materials (BOM), Gerber or ODB++ files, fabrication drawings, and assembly drawings, as well as any other pertinent instructions.
BOM Validation - Confirming component specifications and availability.
DFM Analysis - Identifying potential manufacturing challenges.
Feedback Report - Providing detailed recommendations for improvement.

Quoting Process

We will source quotes to specific vetted suppliers from our approved vendor list based on the design and requirements of the assembly, matching capabilities to the job to optimize costs and lead-times all while providing the highest quality service. We will provide a tiered quote to you, with the quantity price breaks requested, as well as the expected lead-time. Additionally, for those customers with supply chain limitations, ITAR requirements, or specific country of origin sourcing restrictions, we are well versed in supporting those needs.

Component Procurement (Turnkey)

For turnkey projects, we expertly source all necessary components, PCBs, and material from our network of authorized distributors, ensuring component authenticity and quality. We have a robust counterfeit parts program in place to mitigate risks. We understand the importance of reliable sourcing, especially for clients involved with government contracts, which often require strict compliance.

Material Management (Kitted or Turnkey)

We carefully manage, inspect, and organize all components, whether provided by you (kitted) or procured by us (turnkey). This meticulous approach ensures accuracy and efficiency throughout the assembly process.

SMT Assembly

Our technicians program and use state-of-the-art SMT lines place components onto the PCB with exceptional precision and speed, utilizing our advanced Europlacer pick and place machines.

Solder Paste Application and Inspection - Using automated screen printers for precise paste deposition and automated solder paste inspection.
Visual Paste Inspection - While our machines are equipped with SPI, our SMT line operators will still inspect each board to ensure adequate paste coverage and no issues that could affect part placement.
Component Placement - Utilizing pick-and-place machines for accurate placement of SMT components based on the BOM, X-Y data, component datasheets.
Visual Component Inspection - Verifying all component placement, ensuring correct polarities and orientations.

Soldering (Reflow & Selective)

We utilize advanced ERSA reflow ovens and selective soldering machines to create reliable, high-quality solder joints, minimizing the risk of defects.

Profile Optimization - Ensuring correct temperature profiles for each assembly.
Soldering Process - Performing reflow soldering for SMT components, and selective soldering for thru hole devices.
Cooling and Solidification - Allowing solder joints to cool and solidify properly at a controlled temperature gradient.

Automated Optical Inspection (AOI)

We perform thorough AOI using our Mirtec machines to inspect for any defects in component placement and soldering, ensuring the highest level of quality.

X-Ray Inspection

We use our Nordson DAGE X-ray inspection system to examine hidden solder joints, such as those under BGAs, connectors, LGAs, etc., and identify any potential issues that are not visible with AOI.

Testing

We can accommodate functional testing, JTAG testing, and custom test fixture testing to verify the electrical performance of the assembled boards, ensuring they meet your specifications.

Final Quality Inspection

A final, comprehensive quality check is performed before packaging and shipping, ensuring every board meets our rigorous standards and your expectations.

Packaging & Shipping

We carefully package the assembled boards using appropriate materials to protect them during transit and ship them according to your instructions, including drop shipping options to your end customers or carrier warehouses.